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Conductive Foam EMI Shielding

Fills structural seams for EMI shielding and grounding continuity

Definition: Conductive foam is an elastic shielding material with a foam core wrapped in a conductive layer, used for EMI shielding and grounding continuity at structural seams. It can be die-cut into strips, frames and custom-shaped parts.

How It Works

When compressed inside a seam, the conductive covering layer contacts the metal surfaces on both sides and forms a low-impedance path, closing the aperture that would otherwise leak electromagnetic energy and providing a grounding route at the same time. Recovery after compression keeps contact pressure over repeated opening and closing. Actual shielding performance depends on compression state, contact surface conductivity, grounding path and test method (subject to the actual test report).

Key Parameters

Assembly performance

Test itemValueUnitTest standard
Shielding effectiveness≥60–80dB10 MHz–3 GHz
Surface resistance≤0.05Ω/in²25.4 mm × 100 mm
Resistance at 20% compression0.05Ω—
Compression range20–70%Designed to the structural seam
Flame gradeV0—UL94—2018

Conductive adhesive

Test itemValueUnitTest standard
Adhesive thickness0.05±0.005mm—
Adhesive typeAcrylic——
Adhesion1.8kg/25mm—
Temperature resistance-10 to 90°C—
Resistance (vertical / horizontal)0.05 / 0.05Ω—

PU foam core

Test itemValueUnitTest standard
Density45±5kg/m³JIS K7222
Hardness85±5Asker F—
Elongation≥80%JIS K6400-5
Tear strength≥0.4kg/cmJIS K6400-5
Tensile strength≥1.0kg/cmJIS K6400-5
Burning behaviourA—0 mm/min—GB8410

Conductive fabric cover

Test itemValueUnitTest standard
Base materialNi+Cu+Polyester——
Mesh count230T±10——
Base material thickness0.08±0.01mm—

Values shown are indicative specification ranges for selection discussion. Refer to the actual test report of the specific grade. Shielding effectiveness depends on compression state, mounting structure and test method, and should be validated at assembly level.

Typical Applications

ApplicationDescription
Telecom equipmentShielding and grounding at chassis covers, door seams and panel joints
Industrial control cabinetsSeam shielding for cabinet doors and I/O areas, with grounding continuity
Automotive electronicsShielding around consoles and modules subject to vibration and temperature swing
Consumer electronicsShielding at shield cans, connector edges and narrow bezels in compact layouts

Selection Steps

1. Define the band
Identify the target frequency band and seam length, then set the required shielding effectiveness.

2. Measure the seam
Measure the seam gap and tolerance to set compression and cross-section dimensions.

3. Choose core and covering
Match closure force, temperature and weather resistance to the structure and environment.

4. Confirm downstream
Confirm die-cut profile, adhesive backing and grounding path, and whether the adhesive must be conductive.

Common Questions

Q: How much difference is there between 60 dB and 80 dB?

The dB scale is logarithmic: 60 dB means roughly 1,000 times attenuation and 80 dB roughly 10,000 times, so a 20 dB difference is about one order of magnitude. Dr.H New Material conductive foam delivers at least 60–80 dB over 10 MHz–3 GHz. Select against the target band and seam length, and verify at equipment level, since the result also depends on compression, contact surface conductivity and the grounding path (subject to the actual test report).

Q: How do I set the compression?

Set compression from the gap tolerance and the expected resilience life together; 30%–50% is typical for conductive foam. Too little compression gives unstable contact resistance, while too much accelerates resilience loss and raises the required closure force. Confirm the force the cover can deliver (subject to the actual test report).

Q: How do conductive foam, conductive adhesive and conductive fabric differ?

Conductive foam has a foam core with a conductive covering and recovers after compression, so it shields and grounds while filling uneven gaps. Conductive adhesive mainly bonds and fills little. Conductive fabric conforms well but offers almost no thickness compensation. Where a seam needs continuous contact pressure, conductive foam is the preferred choice.

Q: Can it be die-cut, and does it need adhesive backing?

Yes. Dr.H New Material conductive foam can be die-cut to drawing into strips, frames or custom profiles, with adhesive backing and lamination available for automated assembly. Whether to add backing depends on the assembly method; because the adhesive affects the grounding loop, confirm the conductive approach together with the shielding path. The specific process is subject to commercial confirmation.

Provide the seam geometry, frequency band and closure force, and the Dr.H New Material team can propose a shielding effectiveness and compression specification.

Need Conductive Foam Selection Support?

Describe your seam and shielding target to receive a specification proposal and sample arrangement.

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