Industries
Thermal conductive pads fill thermal interfaces; conductive foam shields seams and provides grounding
Dr.H thermal conductive pads and conductive foam are used in humanoid robotics and embodied AI, low-altitude aircraft, AI computing and high-speed optical modules, telecom base stations, energy storage and fast charging, medical devices and space electronics: the pads fill the interface gap between heat sources and heat spreading structures, while the foam handles EMI shielding and grounding at chassis seams. The tables below list operating conditions, typical parts and the specification directions available for each industry; the exact grade is confirmed against power dissipation, gap, operating temperature and assembly method.
1. Robotics and Embodied AI
| Application | Operating conditions | Typical parts | What we provide |
|---|
| Humanoid robots and embodied AI | Dozens of joint motors per unit, sealed joint cavities with small curved gaps, continuous vibration and repeated flexing; temperature rise concentrates under stall and heavy load, while the main SoC runs at high heat flux during inference | Integrated joint modules, stator-to-housing interface of frameless torque motors, servo drive power devices, main compute SoC, micro motors in dexterous hands, torso battery pack | Ultra-soft low-hardness pads selected to gap and vibration duty at the joints, balancing rebound and fatigue resistance; thermal plus dielectric insulation at servo drives; high-conductivity grades by heat flux at the compute section, with profile die-cutting |
| Industrial and collaborative robots | Continuous production duty, heat and signal interference coexisting inside control cabinets, compact layout and limited maintenance windows | Servo drives, cabinet power modules, teach pendant mainboard, I/O and communication interface areas | Joint selection of thermal and shielding materials with sampling and structural fit advice |
| Machine vision and force sensing | Very small module cavities, thermal drift directly affecting measurement and positioning accuracy, optical and sensing surfaces sensitive to contamination | Industrial and 3D vision modules, LiDAR, six-axis force sensors, IMU units | Thin low-stress grades with low-bleed formulation, custom outline and adhesive backing to the mounting face |
2. Low-Altitude Economy and Aerospace
| Application | Operating conditions | Typical parts | What we provide |
|---|
| Industrial drones | Strong weight sensitivity, wide outdoor temperature range together with continuous vibration, while flight control and video link power density approaches server levels | Flight control compute module, ESC, video and data link modules, BMS, onboard power supply | Thin grades selected to weight and assembly gap, with flame retardance and weathering considered, adhesive backing available |
| eVTOL aircraft | High-voltage high-power propulsion with large heat flux swing between take-off and cruise, compact airframe and limited thermal paths | High-voltage electronic control unit, propulsion motor controller, traction battery modules, avionics | Thermally conductive plus dielectric insulation solution to the withstand voltage requirement at high-voltage areas; cell temperature spread control at battery module interfaces |
| Satellite and space electronics | High vacuum, severe thermal cycling and radiation, no in-orbit maintenance; outgassing can contaminate optical and sensing surfaces | On-board computer, phased array payload, power and attitude control units | Low-outgassing requirement confirmed against ASTM E595 TML / CVCM limits; samples prepared for testing once the customer specifies the limits |
3. AI Computing and High-Speed Interconnect
| Application | Operating conditions | Typical parts | What we provide |
|---|
| AI servers and compute clusters | High heat flux at GPUs and power modules, interfacial resistance amplifying local temperature rise, sustained full-load operation | GPU module thermal interface, power modules, accelerator cards, cold plate and chassis interface | Selection by power dissipation and gap, with thermal simulation assessment to support the specification proposal |
| High-speed optical modules and interconnect | DSP, silicon photonics and laser sources concentrated in 800G / 1.6T modules, strictly limited package size, optical path sensitive to bleed-out | DSP and CDR chips, TOSA / ROSA devices, driver and TIA, module housing to cage interface | Thin, low-bleed and low-stress grades, thickness and hardness derived from BLT and allowable assembly pressure |
| Data centres and edge computing | Round-the-clock operation, mixed air and liquid cooling, high node density and accumulated structural tolerance | Switches and NICs, storage and BBU, edge compute units, rack power shelves | Thickness selected to structural tolerance and compression rate, with die-cutting, adhesive backing and zone-based layout |
4. Telecom Base Stations and RF
| Application | Operating conditions | Typical parts | What we provide |
|---|
| 5G-Advanced and telecom base stations | High AAU power consumption, many RF cavity seams, outdoor temperature swing and humidity affecting long-term material stability | Massive MIMO power amplifiers, filter cavities, BBU mainboard, power modules, chassis cover seams | Thermal pads at the PA-to-housing interface; conductive foam selected to seam tolerance and shielding band, available as die-cut frames with adhesive backing |
| Satellite terminals and radar | High and multiple frequency bands coexisting, sensitive to crosstalk, long outdoor service, grounding point resistance affecting shielding result | Phased array terminals, microwave and mmWave radar, feeder grounding, shield can gaskets | Conductive foam providing a low-impedance grounding path, combined with absorber material and shield can gaskets |
5. Energy and Transport Electrification
| Application | Operating conditions | Typical parts | What we provide |
|---|
| Automotive electronics | Compact ECU packaging with temperature rise and vibration combined, requiring stability across vehicle-grade thermal cycling | Vehicle ECU, on-board charger (OBC), domain controller (VCU), mmWave radar, BMS | Selection to vehicle-grade temperature and vibration conditions, with die-cutting, adhesive backing and contour fitting |
| Energy storage and PV inverters | Long-term power device cycling with large day-night temperature difference, unattended sites where maintenance cost outweighs material cost | Energy storage PCS, PV inverter, BMS, busbar and reactors | Long-life low-bleed grades with thickness and hardness matched to temperature range and assembly pressure |
| Fast charging and charging infrastructure | 800 V platform with SiC power modules, high heat flux, liquid cooling units coexisting with outdoor temperature swing | Charging module power devices, liquid cooling unit interface, main control and communication boards, charging gun harness end | Thermally conductive plus insulation solution to the withstand voltage requirement; ultra-soft grades by compression rate at the liquid cooling interface |
6. Medical and Precision Manufacturing
| Application | Operating conditions | Typical parts | What we provide |
|---|
| Medical devices | EMC controlled to IEC 60601-1-2, continuous long-hour operation, sensitive to oil bleed and cleanliness | CT / MRI / DR imaging equipment, ultrasound probe and main unit, patient monitors, laser therapy devices, in-vitro diagnostics, surgical robots | Low-bleed long-life grades; shielding and thermal management laid out by zone to reduce assembly steps |
| Semiconductor and electronics manufacturing equipment | High precision temperature control, cleanroom constraints on volatiles, fast line tact time and short maintenance windows | Test and sorting handler electronics, bonding and packaging equipment power modules, electronics around vacuum chambers, motion control drives | Grades selected to temperature control accuracy and gap; low-outgassing requirements confirmed against customer limits before testing |
| Industrial power supplies and control | Continuous heating in rectifier and power modules, relatively large structural tolerance, long service with limited maintenance windows | Rectifier modules, power devices, transformers, chassis thermal surfaces, PLC and servo drives | Thickness customized to gap and tolerance, meeting flame retardance and insulation requirements |
7. Consumer Electronics and Smart Hardware
| Application | Operating conditions | Typical parts | What we provide |
|---|
| Consumer electronics | Compact internal space and thin gaps, fast assembly tact time, high demand on dimensional consistency | Main chip thermal interface, display module, small power modules | Thin grades and precision die-cutting with adhesive backing for automated assembly |
| XR and wearables | Worn close to the body, limited enclosure temperature rise, extremely tight space and weight budget | AR / VR mainboard and optical module, AI earbuds, smart watches and bands | Thin low-density grades selected to the enclosure temperature target and assembly gap |
Operating conditions differ considerably between industries. Please provide power dissipation, gap, operating temperature and assembly method so the selection can be made for your case. Where low outgassing, medical EMC or high-voltage insulation limits apply, please state the standard and the limits; we prepare samples and test against those figures. All parameters are subject to the actual test report.
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